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India
ConferenceEngineering And Technology
International Conference on Electronics Packaging and Assembly Engineering
Event Starts
67Days
02Hours
53Minutes
04Seconds
IC-EPAE
Tue, Aug 18, 2026- Wed, Aug 19, 2026
Bat Yam, Israel
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
IC-EPAE
Tue, Aug 18, 2026- Wed, Aug 19, 2026
Bat Yam, Israel
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Objective of the Conference
The main purpose of International Conference on Electronics Packaging and Assembly Engineering is to bring industry professionals, experts, academicians, and scholars to discuss their expertise for better collaboration in the field.
Important Dates
Start Date
Tuesday, August 18, 2026
End Date
Wednesday, August 19, 2026
Registration Deadline
Monday, August 3, 2026
Submission Deadline
Wednesday, July 29, 2026
Conference Agenda
| Timing | Sessions |
|---|---|
| 09:00 AM – 09:30 AM | Registration & Welcome Coffee Kit Collection |
| 09:30 AM – 09:45 AM | Networking Tea Break |
| 09:45 AM – 10:30 AM | Opening Plenary Session: Welcome Address & Keynote |
| 10:30 AM – 01:00 PM | Session I |
| 01:00 PM – 01:30 PM | Lunch Break |
| 01:30 PM – 04:00 PM | Session II |
| 04:05 PM – 04:15 PM | Group Photo & Final Networking Session |
| 04:15 PM – 05:00 PM | Closing Address: Reflections & Awards Presentation |
