ConferenceEngineering
International Conference on Electronics Packaging and Assembly Engineering
Event Starts
120Days
08Hours
58Minutes
13Seconds
IC-EPAE
Sat, Oct 3, 2026- Sun, Oct 4, 2026
Colombo, Sri Lanka
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
IC-EPAE
Sat, Oct 3, 2026- Sun, Oct 4, 2026
Colombo, Sri Lanka
The aim of the Conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet the share cuttingedge development in the field.
Objective of the Conference
International Conference on Electronics Packaging and Assembly Engineering aims to discuss trending subjects to initiate interesting discussions. Also, these events will welcome researchers, students, scholars, and professionals from around the globe. You can meet exceptional personalities, build connections and create remarkable participation. Attendance in these events will open doors to new opportunities.
Important Dates
Start Date
Saturday, October 3, 2026
End Date
Sunday, October 4, 2026
Registration Deadline
Friday, September 18, 2026
Submission Deadline
Sunday, September 13, 2026
Conference Agenda
| Timing | Sessions |
|---|---|
| 09:00 AM – 09:30 AM | Registration & Welcome Coffee Kit Collection |
| 09:30 AM – 09:45 AM | Networking Tea Break |
| 09:45 AM – 10:30 AM | Opening Plenary Session: Welcome Address & Keynote |
| 10:30 AM – 01:00 PM | Session I |
| 01:00 PM – 01:30 PM | Lunch Break |
| 01:30 PM – 04:00 PM | Session II |
| 04:05 PM – 04:15 PM | Group Photo & Final Networking Session |
| 04:15 PM – 05:00 PM | Closing Address: Reflections & Awards Presentation |
